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Fabrication, Experimentation and Numerical Simulation of Micro Channel Heat Sink for Enhancing Thermal Performance of Electronic Devices by Kapil R. Aglawe; Ravindra K. Yadav; Sanjeev B. Thool is a Engineering article available to read on EtoBox.

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The reliable functioning of next-generation electronic devices within their temperature limits is contingent upon the efficient removal of high heat flux. Interfaces between the device, heat spreaders, and heat sink contribute significantly to thermal resistance in conventional chip packages. The elimination of interface resistances can lead to a noteworthy decrease in overall thermal resistance by incorporating the heat sink directly into the heat-generating device. The current study involved the manufacturing, simulation and experimentation of a micro channel heat sink. The micro channel assembly is manufactured with dimensions of 50 × 50 × 3 mm. The length of micro channel is 35 mm having height and width of 0.2 mm with 58 channels. The experimentation and numerical simulation was done with considering the various parameters like mass flow rate, heat flux, and inlet temperature of nanofluid. The microchannel heat sink improved electronic device thermal performance in fabrication, experimentation, and numerical simulation. The heat sink lowered device temperatures and prevented overheating. Nanofluid at 0.3% volume and at a mass flow rate of 8 m/s, the heat transfer coefficient r

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Author

Kapil R. Aglawe; Ravindra K. Yadav; Sanjeev B. Thool

Publisher

Springer Science and Business Media LLC

Published

2023

Language

EN

Field

Engineering (Physical Sciences)