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About this Engineering article
Electrical and Adhesion Properties of Plasma-polymerised Ultra-low K Dielectric Films with High Thermal Stability by M Uhlig; A Bertz; M Rennau; S.E Schulz; T Werner; T Gessner is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- M Uhlig; A Bertz; M Rennau; S.E Schulz; T Werner; T Gessner
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0167-9317)
- Published
- 2000
- Language
- EN
- Field
- Engineering (Physical Sciences)
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