About this scholarly article

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) - Generalized PEEC models for three-dimensional interconnect structures and integrated passives of arbitrary shapes by Aosheng Rong, ; Cangellaris, A.C. is a scholarly article available to read on EtoBox.

Author

Aosheng Rong, ; Cangellaris, A.C.

Publisher

IEEE

Published

2001

Language

EN