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About this Engineering article
Capturing the Complex Physics Behind Universal Grain Size Distributions in Thin Metallic Films by Backofen, R.; Barmak, K.; Elder, K.E.; Voigt, A. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Backofen, R.; Barmak, K.; Elder, K.E.; Voigt, A.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 1359-6454)
- Published
- 2014
- Language
- EN
- Field
- Engineering (Physical Sciences)
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