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About this Engineering article
A Parylene-filled-trench Technique for Thermal Isolation in Silicon-based Microdevices by Lei, Yinhua; Wang, Wei; Yu, Huaiqiang; Luo, Yingcun; Li, Ting; Jin, Yufeng; Zhang, Haixia; Li, Zhihong is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Lei, Yinhua; Wang, Wei; Yu, Huaiqiang; Luo, Yingcun; Li, Ting; Jin, Yufeng; Zhang, Haixia; Li, Zhihong
- Publisher
- Institute of Physics; IOP Publishing; Institute of Physics Publishing; ScienceOpen (ISSN 0960-1317)
- Published
- 2009
- Language
- EN
- Field
- Engineering (Physical Sciences)