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About this Materials Science article
Microstructure and mechanical properties of Sn–1.0Ag–0.5Cu solder with minor Zn additions by Leong, Y. M.; Haseeb, A. S. M. A.; Nishikawa, Hiroshi; Mokhtari, Omid is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Leong, Y. M.; Haseeb, A. S. M. A.; Nishikawa, Hiroshi; Mokhtari, Omid
- Publisher
- Springer US; Springer-Verlag; Kluwer Academic Publishers; Springer Science and Business Media LLC; Society for Mining, Metallurgy and Exploration Inc. (ISSN 0957-4522)
- Published
- 2019
- Language
- EN
- ISBN
- 9781085401906
- Field
- Materials Science (Physical Sciences)
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