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Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages by Tong Yan Tee; Zhaowei Zhong is a Engineering article available to read on EtoBox.

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Due to requirements of cost-saving and miniaturization, stacked die BGA has recently gained popularity in many applications. However, its board level solder joint reliability during the thermal cycling test is not as well-studied as common single die BGA. In this paper, solder joint fatigue of wirebond stacked die BGA is analyzed in detail. 3D fatigue model is established for stacked die BGA with considerations of detailed pad design, realistic shape of solder ball, and non-linear material properties. The fatigue model applied is based on a modified Darveaux's approach with non-linear viscoplastic analysis of solder joints. The critical solder ball is observed located between the top and bottom dice corner, and failure interface is along the top solder/pad interface. The modeling predicted fatigue life is first correlated to the thermal cycling test results using modified correlation constants, curve-fitted from in-house TFBGA (thin-profile fine-pitch BGA) thermal cycling test data. Subsequently, design analyses are performed to study the effects of 16 key design variations in package dimensions, material properties, and thermal cycling test conditions. In general, smaller top and

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Author

Tong Yan Tee; Zhaowei Zhong

Publisher

Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)

Published

2004

Language

EN

Field

Engineering (Physical Sciences)