About this scholarly article

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology - Challenges to the electronics packaging technologies for the volume integration of components in medical tools and instruments by Wagner, David; Schmidt, Bertram; Detert, Markus is a scholarly article available to read on EtoBox.

Author

Wagner, David; Schmidt, Bertram; Detert, Markus

Publisher

IEEE

Published

2014

Language

EN