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About this Engineering article
Direct Solder Bump Formation Technique on Al Pad and Its High Reliability by Ogashiwa, Toshinori; Akimoto, Hideyuki; Shigyo, Hiroyuki; Murakami, Yoshihiro; Inoue, Akihisa; Masumoto, Tsuyoshi is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Ogashiwa, Toshinori; Akimoto, Hideyuki; Shigyo, Hiroyuki; Murakami, Yoshihiro; Inoue, Akihisa; Masumoto, Tsuyoshi
- Publisher
- Institute of Pure and Applied Physics; Japan Society of Applied Physics; IOP Publishing (ISSN 0021-4922)
- Published
- 1992
- Field
- Engineering (Physical Sciences)