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About this Engineering article
Signal Amplification for Electrochemical Immunosensing by in Situ Assembly of Host–guest Linked Gold Nanorod Superstructure on Immunocomplex by Lin, Dajie; Wu, Jie; Ju, Huangxian; Yan, Feng is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Lin, Dajie; Wu, Jie; Ju, Huangxian; Yan, Feng
- Publisher
- Elsevier Science; Elsevier ; Elsevier Ltd.; Elsevier BV (ISSN 0956-5663)
- Published
- 2013
- Language
- EN
- Field
- Engineering (Physical Sciences)
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