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About this Engineering article
Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint by Ahmed, Md. Tusher; Motalab, Mohammad; Suhling, Jeffrey C. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Ahmed, Md. Tusher; Motalab, Mohammad; Suhling, Jeffrey C.
- Publisher
- Springer US; Springer-Verlag; Springer New York LLC; Springer Science and Business Media LLC (ISSN 0361-5235)
- Published
- 2020
- Field
- Engineering (Physical Sciences)
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