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About this Engineering article
The effects of the Reynolds number and width ratio on the flow distribution in manifolds of liquid cooling modules for electronic packaging by Steve H. Choi; Sehyun Shin; Young I. Cho is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Steve H. Choi; Sehyun Shin; Young I. Cho
- Publisher
- Elsevier Science; Elsevier ; Elsevier Ltd.; Elsevier BV (ISSN 0735-1933)
- Published
- 1993
- Language
- EN
- Field
- Engineering (Physical Sciences)