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About this Engineering article

Designing test interconnect structures for micro-scale stress measurement: An analytical guidance by Y. Shen; Y. L. Guo is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
Y. Shen; Y. L. Guo
Publisher
AVS (American Vacuum Society); American Vacuum Society; American Institute of Physics (ISSN 0734-211X)
Published
1999
Language
EN
Field
Engineering (Physical Sciences)

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