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This study investigates the bonding properties and thermoelectric transport characteristics of different crystallographic orientation interfaces of Cu3Sn/Cu using first-principles calculations. The results indicate that all interfaces exhibit stable structures, with the Cu3Sn <010>⊥Cu (100) interface showing superior electrical and thermal conductivity compared to others. The findings highlight the importance of interfacial orientation on the performance and reliability of electronic packaging materials.
- Author
- mohsenabdinasab
- Language
- EN